JunPus

Thermal Interface Material Exporter, Factory in Taiwan

With advanced science and technology, our company develops and manufactures various kinds of 

Thermal Pad

. We will continue to innovate on our technology, management, services and business to meet future challenges and fulfill our responsibilities.

We make available for our clients a top-of-the-line range of Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Thermal Pad based on silica gel as a substrate, adding metal oxides and other auxiliary materials, a thermal conductivity of dielectric materials synthesized through a special process. The pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. It is designed to take advantage of the design of the gap transfer heat production, able to fill the gap to complete the heat transfer between the heating part and cooling parts, and also played the role of insulation, cushioning, sealing, etc. It is able to meet the requirements of equipment miniaturization and ultra-thin design, is an excellent thermal conductivity filler material whit highly technology use, and for a wide range of thickness. Our products also have high thermal stability that results in making them perform under severe conditions.

Thermal Conductive Pad |Thermal Pad LED Thermal pad manufacturer Thermal Pads supplier from Taiwan wholesaler distributor-Jun Pus International Co., Ltd.

Nano Diamond Thermal Pad P400

Nano Diamond Thermal Pad P400

JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

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Nano Diamond Thermal Pad P300

Nano Diamond Thermal Pad P300

 

JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

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Nano Diamond Thermal Pad P230

Nano Diamond Thermal Pad P230

 

JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

Additional Info

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Nano Diamond Thermal Pad P130

Nano Diamond Thermal Pad P130

 

JP-P130 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P130 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P130 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

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High Thermal Pad P600

High Thermal Pad P600

JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 
JPP600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 
JP-P600 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

Additional Info

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