Computer Blister Packing: Thermal Blister Packing Manufacturer, italy CPU Thermal Blister Packing Supplier, Taiwan CPU Thermal Blister Packing,italy, Manufacturer,Supplier,Exporter,Factory, distributor - Product OEM ODM
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.